5962-9559510HXC
512K X 8 MULTI DEVICE SRAM MODULE, 17 ns, CQFP

From Defense Logistics Agency

StatusACTIVE
Access Time-Max (tACC)17 ns
Alternate Memory Width16
Memory Density4.19E6 deg
Memory IC TypeMULTI DEVICE SRAM MODULE
Memory Width8
Mfr Package DescriptionCERAMIC, QFP-68
Number of Functions1
Number of Words524288 words
Number of Words Code512K
Operating ModeASYNCHRONOUS
Operating Temperature-Max125 Cel
Operating Temperature-Min-55 Cel
Organization512K X 8
Package Body MaterialCERAMIC, METAL-SEALED COFIRED
Package StyleFLATPACK
Parallel/SerialPARALLEL
Supply Voltage-Max (Vsup)5.5 V
Supply Voltage-Min (Vsup)4.5 V
Supply Voltage-Nom (Vsup)5 V
Surface MountYes
TechnologyCMOS
Temperature GradeMILITARY
Terminal FinishGOLD
Terminal FormFLAT
Terminal Pitch1.27 mm
Terminal PositionQUAD

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