V58C2256804SCF5D 32M X 8 DDR DRAM, 0.65 ns, PBGA60
From PROMOS TECHNOLOGIES INC
| Status | Active |
| Access Mode | FOUR BANK PAGE BURST |
| Access Time-Max | 0.6500 ns |
| Additional Feature | AUTO/SELF REFRESH |
| Clock Frequency-Max (fCLK) | 200 MHz |
| EU RoHS Compliant | Yes |
| I/O Type | COMMON |
| Interleaved Burst Length | 2,4,8 |
| JESD-30 Code | R-PBGA-B60 |
| Length | 13 mm |
| Memory Density | 2.68E8 bit |
| Memory IC Type | DDR DRAM |
| Memory Width | 8 |
| Mfr Package Description | ROHS COMPLIANT, MO-233, FBGA-60 |
| Moisture Sensitivity Level | NOT SPECIFIED |
| Number of Functions | 1 |
| Number of Ports | 1 |
| Number of Terminals | 60 |
| Number of Words | 3.36E7 words |
| Number of Words Code | 32M |
| Operating Mode | SYNCHRONOUS |
| Operating Temperature-Max | 70 Cel |
| Operating Temperature-Min | 0.0 Cel |
| Organization | 32MX8 |
| Output Characteristics | 3-STATE |
| Package Body Material | PLASTIC/EPOXY |
| Package Code | TBGA |
| Package Equivalence Code | BGA60,9X12,40/32 |
| Package Shape | RECTANGULAR |
| Package Style | GRID ARRAY, THIN PROFILE |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Power Supplies (V) | 2.6 |
| Qualification Status | COMMERCIAL |
| Refresh Cycles | 8192 |
| Seated Height-Max | 1.2 mm |
| Sequential Burst Length | 2,4,8 |
| Standby Current-Max | 0.0300 Amp |
| Sub Category | DRAMs |
| Supply Current-Max | 0.4000 Amp |
| Supply Voltage-Max (Vsup) | 2.7 V |
| Supply Voltage-Min (Vsup) | 2.5 V |
| Supply Voltage-Nom (Vsup) | 2.6 V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | COMMERCIAL |
| Terminal Finish | NOT SPECIFIED |
| Terminal Form | BALL |
| Terminal Pitch | 1 mm |
| Terminal Position | BOTTOM |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Width | 8 mm |
