periods may affect device reliability. 2 Specification is for device in free air: 14-Pin Plastic DIP Package: JA = 75C/Watt 14-Pin SOIC Package: JA = 120C/Watt ORDERING GUIDE Model Temperature Range Package Description Package Options AD8013AN AD8013AR-14 AD8013AR-14-REEL AD8013AR-14-REEL7 AD8013ACHIPS -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C 14-Pin Plastic DIP 14-Pin Plastic SOIC 14-Pin Plastic SOIC 14-Pin Plastic SOIC Die Form N-14 R-14 R-14 R-14 MAXIMUM POWER DISSIPATION - Watts 2.5 TJ = +150C 2.0 14-PIN DIP PACKAGE 1.5 14-PIN SOIC 1.0 0.5 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 AMBIENT TEMPERATURE - C 80 90 Maximum Power Dissipation vs. Ambient Temperature REV. A -3- AD8013 METALIZATION PHOTO Contact factory for latest dimensions. Dimensions shown in inches and (mm). +vs +IN1 5 4 DISABLE 3 3 -IN1 6 2 DISABLE 2 OUT1 7 1 DISABLE 1 0.044 (1.13) 14 OUT 2 OUT3 8 -IN3 9 10 +IN3 12 +IN2 11 -VS 13 -IN2 0.071 (1.81) 6 12 5 10 OUTPUT VOLTAGE SWING - V p-p COMMON-
12 Pages, 240 KB, Originalperiods may affect device reliability. 2 Specification is for device in free air: 14-Pin Plastic DIP Package: JA = 75C/Watt 14-Pin SOIC Package: JA = 120C/Watt ORDERING GUIDE Model Temperature Range Package Description Package Options AD8013AN AD8013AR-14 AD8013AR-14-REEL AD8013AR-14-REEL7 AD8013ACHIPS -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C 14-Pin Plastic DIP 14-Pin Plastic SOIC 14-Pin Plastic SOIC 14-Pin Plastic SOIC Die Form N-14 R-14 R-14 R-14 MAXIMUM POWER DISSIPATION - Watts 2.5 TJ = +150C 2.0 14-PIN DIP PACKAGE 1.5 14-PIN SOIC 1.0 0.5 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 AMBIENT TEMPERATURE - C 80 90 Maximum Power Dissipation vs. Ambient Temperature REV. A -3- AD8013 METALIZATION PHOTO Contact factory for latest dimensions. Dimensions shown in inches and (mm). +vs +IN1 5 4 DISABLE 3 3 -IN1 6 2 DISABLE 2 OUT1 7 1 DISABLE 1 0.044 (1.13) 14 OUT 2 OUT3 8 -IN3 9 10 +IN3 12 +IN2 11 -VS 13 -IN2 0.071 (1.81) 6 12 5 10 OUTPUT VOLTAGE SWING - V p-p COMMON-
13 Pages, 235 KB, Originalperiods may affect device reliability. 2 Specification is for device in free air: 14-Pin Plastic DIP Package: JA = 75C/Watt 14-Pin SOIC Package: JA = 120C/Watt ORDERING GUIDE Model Temperature Range Package Description Package Options AD8013AN AD8013AR-14 AD8013AR-14-REEL AD8013AR-14-REEL7 AD8013ACHIPS -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C 14-Pin Plastic DIP 14-Pin Plastic SOIC 14-Pin Plastic SOIC 14-Pin Plastic SOIC Die Form N-14 R-14 R-14 R-14 MAXIMUM POWER DISSIPATION - Watts 2.5 TJ = +150C 2.0 14-PIN DIP PACKAGE 1.5 14-PIN SOIC 1.0 0.5 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 AMBIENT TEMPERATURE - C 80 90 Maximum Power Dissipation vs. Ambient Temperature REV. A -3- AD8013 METALIZATION PHOTO Contact factory for latest dimensions. Dimensions shown in inches and (mm). +vs +IN1 5 4 DISABLE 3 3 -IN1 6 2 DISABLE 2 OUT1 7 1 DISABLE 1 0.044 (1.13) 14 OUT 2 OUT3 8 -IN3 9 10 +IN3 12 +IN2 11 -VS 13 -IN2 0.071 (1.81) 6 12 5 10 OUTPUT VOLTAGE SWING - V p-p COMMON-
12 Pages, 233 KB, Original
