pplications. * High Current * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. * * * The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Device Marking: BCP53T1G = AH BCP53-10T1G = AH-10 BCP53-16T1G = AH-16 S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TC = 25C unless otherwise noted) Symbol Value Unit Collector-Emitter Voltage VCEO -80 Vdc Collector-Base Voltage VCBO -100 Vdc Emitter-Base Voltage Rating VEBO -5.0 Vdc Collector Current IC 1.5 Adc Total Power Dissipation @ TA = 25C (Note 1) Derate above 25C PD 1.5 12 W mW/C Operating and Storage Temperature Range TJ, Tstg C -65 to +150 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

pplications. * High Current * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. * * * The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Device Marking: BCP53T1G = AH BCP53-10T1G = AH-10 BCP53-16T1G = AH-16 S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant http://onsemi.com MEDIUM POWER HIGH CURRENT SURFACE MOUNT PNP TRANSISTORS COLLECTOR 2, 4 1 BASE EMITTER 3 MARKING DIAGRAM 4 1 MAXIMUM RATINGS (TC = 25C unless otherwise noted) Symbol Value Unit Collector-Emitter Voltage VCEO -80 Vdc Collector-Base Voltage VCBO -100 Vdc Emitter-Base Voltage VEBO -5.0 Vdc Collector Current IC 1.5 Adc Total Power Dissipation @ TA = 25C (Note 1) Derate above 25C PD 1.5 12 W mW/C Operating and Storage Temperature Range TJ, Tstg -65 to +150 C Rating Stresses exceeding thos

pplications. * High Current * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. * * * The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Device Marking: BCP53T1G = AH BCP53-10T1G = AH-10 BCP53-16T1G = AH-16 S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TC = 25C unless otherwise noted) Symbol Value Unit Collector-Emitter Voltage VCEO -80 Vdc Collector-Base Voltage VCBO -100 Vdc Emitter-Base Voltage Rating VEBO -5.0 Vdc Collector Current IC 1.5 Adc Total Power Dissipation @ TA = 25C (Note 1) Derate above 25C PD 1.5 12 W mW/C Operating and Storage Temperature Range TJ, Tstg C -65 to +150 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

pplications. * High Current * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. * * * The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Device Marking: BCP53T1G = AH BCP53-10T1G = AH-10 BCP53-16T1G = AH-16 S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TC = 25C unless otherwise noted) Symbol Value Unit Collector-Emitter Voltage VCEO -80 Vdc Collector-Base Voltage VCBO -100 Vdc Emitter-Base Voltage Rating VEBO -5.0 Vdc Collector Current IC 1.5 Adc Total Power Dissipation @ TA = 25C (Note 1) Derate above 25C PD 1.5 12 W mW/C Operating and Storage Temperature Range TJ, Tstg C -65 to +150 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

pplications. * High Current * NPN Complement is BCP56 * The SOT-223 Package can be soldered using wave or reflow. * * * The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die Device Marking: BCP53T1G = AH BCP53-10T1G = AH-10 BCP53-16T1G = AH-16 S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS (TC = 25C unless otherwise noted) Symbol Value Unit Collector-Emitter Voltage VCEO -80 Vdc Collector-Base Voltage VCBO -100 Vdc Emitter-Base Voltage Rating VEBO -5.0 Vdc Collector Current IC 1.5 Adc Total Power Dissipation @ TA = 25C (Note 1) Derate above 25C PD 1.5 12 W mW/C Operating and Storage Temperature Range TJ, Tstg C -65 to +150 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

83.3 C/W 260 10 C s Lead Temperature for Soldering, 0.0625 from case Time in Solder Bath TL = Assembly Location = Year = Work Week = Specific Device Code = Pb-Free Package ORDERING INFORMATION Package Shipping BCP53T1G SOT-223 (Pb-Free) 1000/Tape & Reel SBCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel SBCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel SBCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000/Tape & Reel THERMAL CHARACTERISTICS Characteristic 1 (*Note: Microdot may be in either location) Device Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1

onductor Components Industries, LLC, 2011 November, 2011 - Rev. 8 1 = Assembly Location = Year = Work Week = Specific Device Code = Pb-Free Package (*Note: Microdot may be in either location) Package Shipping BCP53T1G SOT-223 (Pb-Free) 1000 / Tape & Reel SBCP53-10T1G SOT-223 (Pb-Free) 1000 / Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000 / Tape & Reel SBCP53-10T1G SOT-223 (Pb-Free) 1000 / Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000 / Tape & Reel SBCP53-16T1G SOT-223 (Pb-Free) 1000 / Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000 / Tape & Reel Device THERMAL CHARACTERISTICS Characteristic AYW XXXXXG G 1 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: BCP53T1/D BCP53 Series, SBCP53 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Min Typ Max Unit Collector-Base Breakdown Voltage (IC = -100 mAdc, I

it board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. ORDERING INFORMATION Device Package Shipping BCP53T1 SOT-223 1000/Tape & Reel BCP53T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-10T1 SOT-223 1000/Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T1 SOT-223 1000/Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T3 SOT-223 4000/Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2008 February, 2008 - Rev. 6 1 Publication Order Number: BCP53T1/D BCP53 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Min Typ Max Unit CollectorBase Breakdown Voltage (IC = -100 Adc, IE = 0) V(BR)CBO -100 - - Vdc CollectorEmitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) V(BR)CEO -80 - - Vdc

d circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. ORDERING INFORMATION Package Shipping BCP53T1 SOT-223 1000/Tape & Reel BCP53T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-10T1 SOT-223 1000/Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T1 SOT-223 1000/Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T3 SOT-223 4000/Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000/Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 BCP53 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Min Typ Max Unit CollectorBase Breakdown Voltage (IC = -100 Adc, IE = 0) V(BR)CBO -100 - - Vdc CollectorEmitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) V(BR)CEO -80 - - Vdc CollectorEmitter Breakdown Voltage (IC = -100 Adc, RBE = 1.0 kohm) V(BR)CER -100 - - Vdc EmitterBase Bre

it board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. ORDERING INFORMATION Device Package Shipping BCP53T1 SOT-223 1000/Tape & Reel BCP53T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-10T1 SOT-223 1000/Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T1 SOT-223 1000/Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T3 SOT-223 4000/Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2008 February, 2008 - Rev. 6 1 Publication Order Number: BCP53T1/D BCP53 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Min Typ Max Unit CollectorBase Breakdown Voltage (IC = -100 Adc, IE = 0) V(BR)CBO -100 - - Vdc CollectorEmitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) V(BR)CEO -80 - - Vdc

ly Location Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping BCP53T1 SOT-223 1000/Tape & Reel BCP53T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-10T1 SOT-223 1000/Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T1 SOT-223 1000/Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T3 SOT-223 4000/Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2007 August, 2007 - Rev. 5 1 Publication Order Number: BCP53T1/D BCP53 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Symbol Min Typ Max Unit CollectorBase Breakdown Voltage (IC = -100 Adc, IE = 0) V(BR)CBO -100 - - Vdc CollectorEmitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) V(BR)CEO -80 - - Vdc Co

on a glass epoxy printed circuit board 1.575 in. x 1.575 in. x 0.059 in.; mounting pad for the collector lead min. 0.93 sq. in. (c) Semiconductor Components Industries, LLC, 2010 AYW XXXXXG G 1 Package Shipping BCP53T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-10T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T1G SOT-223 (Pb-Free) 1000/Tape & Reel BCP53-16T3G SOT-223 (Pb-Free) 4000/Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Publication Order Number: BCP53T1/D BCP53 Series ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristics Symbol Min Typ Max Unit Collector-Base Breakdown Voltage (IC = -100 mAdc, IE = 0) V(BR)CBO -100 - - Vdc Collector-Emitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0) V(BR)CEO -80 - - Vdc Collector-Emitter Breakdown Voltage (IC = -100 mAdc, RBE = 1.0 kW) V(BR)CER -100 - - Vdc Emitter-Base Breakdown Voltage (IE