1G17DRYRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier in
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
1G17DRYRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier in
1G17DRYRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier in
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
rge Bump - YZP (Pb-free) NanoFree - WCSP (DSBGA) 0.23-mm Large Bump - YZV (Pb-free) SOT (SOT-23) - DBV SOT (SC-70) - DCK SOT (SOT-553) - DRL SN74LVC1G17YZPR Reel of 3000 SN74LVC1G17YZVR Reel of 3000 SN74LVC1G17DBVR Reel of 250 SN74LVC1G17DBVT Reel of 3000 SN74LVC1G17DCKR Reel of 250 SN74LVC1G17DCKT Reel of 4000 SN74LVC1G17DRLR ____ C7 C17_ C7_ C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YEP, YZA/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2 has two chara
1G17DRYRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier in
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
1G17DRYRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier in
1G17DRYRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK (1) (2) (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 SOT (SOT-553) - DRL SN74LVC1G17DCKR Reel of 4000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier in
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
4LVC1G17DRYRG4 C7_ SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVR SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 -40C to 85C Tube of 250 C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 SOT (SC-70) - DCK SOT (SOT-553) - DRL (2) (3) SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 Tube of 250 (1) SN74LVC1G17DCKR Reel of 4000 SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DRLR SN74LVC1G17DRLRG4 C7_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/a
YRG4 SN74LVC1G17DSFR C7 C7 SN74LVC1G17DBV3 Reel of 3000 SOT (SOT-23) - DBV SN74LVC1G17DBVRE4 SN74LVC1G17DBVRG4 Tube of 250 -40C to 85C SN74LVC1G17DBVR C17 SN74LVC1G17DBVT SN74LVC1G17DBVTE4 SN74LVC1G17DCK3 Reel of 3000 Tube of 250 Jumbo Reel of 10000 (3) 2 SN74LVC1G17DCKRE4 SN74LVC1G17DCKRG4 SOT (SC-70) - DCK (1) (2) SN74LVC1G17DCKR SOT (SOT-553) - DRL Reel of 4000 SON - DPK Reel of 5000 C7_ SN74LVC1G17DCKT SN74LVC1G17DCKTE4 SN74LVC1G17DCKJ SN74LVC1G17DRLR SN74LVC1G17DRLRG4 SN74LVC1G17DPKR C7_ C7_ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followin