SLVS908C - FEBRUARY 2009 - REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SON - DRG -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING (3) TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ TPS22949AYZPR _ _ _4Z_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE Table 1. YZP PACKAGE TERMINAL ASSIGNMENTS D D C C D EN1 OC B B C VIN VOUTCL A A B GND VOUTLDO A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View DRG PACKAGE (TOP VIEW) EN2 1 GND 2 VIN 3 EN1 4 Exposed Thermal Die Pad on Undersi
SLVS908C - FEBRUARY 2009 - REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SON - DRG -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING (3) TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ TPS22949AYZPR _ _ _4Z_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE Table 1. YZP PACKAGE TERMINAL ASSIGNMENTS D D C C D EN1 OC B B C VIN VOUTCL A A B GND VOUTLDO A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View DRG PACKAGE (TOP VIEW) EN2 1 GND 2 VIN 3 EN1 4 Exposed Thermal Die Pad on Undersi
SLVS908C - FEBRUARY 2009 - REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SON - DRG -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING (3) TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ TPS22949AYZPR _ _ _4Z_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE Table 1. YZP PACKAGE TERMINAL ASSIGNMENTS D D C C D EN1 OC B B C VIN VOUTCL A A B GND VOUTLDO A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View DRG PACKAGE (TOP VIEW) EN2 1 GND 2 VIN 3 EN1 4 Exposed Thermal Die Pad on Undersi
SLVS908C - FEBRUARY 2009 - REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SON - DRG -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING (3) TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ TPS22949AYZPR _ _ _4Z_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE Table 1. YZP PACKAGE TERMINAL ASSIGNMENTS D D C C D EN1 OC B B C VIN VOUTCL A A B GND VOUTLDO A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View DRG PACKAGE (TOP VIEW) EN2 1 GND 2 VIN 3 EN1 4 Exposed Thermal Die Pad on Undersi
SLVS908C - FEBRUARY 2009 - REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SON - DRG -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING (3) TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ TPS22949AYZPR _ _ _4Z_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE Table 1. YZP PACKAGE TERMINAL ASSIGNMENTS D D C C D EN1 OC B B C VIN VOUTCL A A B GND VOUTLDO A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View DRG PACKAGE (TOP VIEW) EN2 1 GND 2 VIN 3 EN1 4 Exposed Thermal Die Pad on Undersi
................................................ www.ti.com ORDERING INFORMATION TA PACKAGE SON - DRG -40C to 85C (1) (2) (3) (1) (2) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ (3) TPS22949AYZPR _ _ _4Z_ (3) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE YZP PACKAGE TERMINAL ASSIGNMENTS D D D EN1 OC C C C VIN VOUTCL B B B GND VOUTLDO A A A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View 1 VIN 3 EN1 4 IE 2 PR GND Exposed Thermal Die Pad on Underside EV EN2 W DRG PACKAGE (TO
................................................ www.ti.com ORDERING INFORMATION TA PACKAGE SON - DRG -40C to 85C (1) (2) (3) (1) (2) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ (3) TPS22949AYZPR _ _ _4Z_ (3) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE YZP PACKAGE TERMINAL ASSIGNMENTS D D D EN1 OC C C C VIN VOUTCL B B B GND VOUTLDO A A A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View 1 VIN 3 EN1 4 IE 2 PR GND Exposed Thermal Die Pad on Underside EV EN2 W DRG PACKAGE (TO
SLVS908C - FEBRUARY 2009 - REVISED JANUARY 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA SON - DRG -40C to 85C (1) (2) (3) ORDERABLE PART NUMBER Tape and reel WCSP - YZP Tape and reel TOP-SIDE MARKING (3) TPS22949ADRGR ZUG TPS22949YZPR _ _ _4Y_ TPS22949AYZPR _ _ _4Z_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, * = Pb-free). YZP PACKAGE Table 1. YZP PACKAGE TERMINAL ASSIGNMENTS D D C C D EN1 OC B B C VIN VOUTCL A A B GND VOUTLDO A EN2 V+ 2 1 2 1 Laser Marking View 1 2 Bump View DRG PACKAGE (TOP VIEW) EN2 1 GND 2 VIN 3 EN1 4 Exposed Thermal Die Pad on Undersi