or ordering. However, due to limited space, the Top Side Marking on all packages use an abbreviated 9-digit number. PACKAGE TYPE SN SOIC-8 150mil SS SOIC-8 208mil ZP(1) WSON-8 6x5mm DENSITY 4M-bit 4M-bit 4M-bit PRODUCT NUMBER TOP SIDE MARKING W25Q40BVSNIG W25Q40BVSNIP W25Q40BVSSIG W25Q40BVSSIP W25Q40BVZPIG W25Q40BVZPIP 25Q40BVNIG 25Q40BVNIP 25Q40BVSIG 25Q40BVSIP 25Q40BVIG 25Q40BVIP Note: 1. WSON package type ZP is not used in the top side marking. - 69 - Publication Release Date: March 26,2009 Preliminary - Revision A W25Q40BV 12. REVISION HISTORY VERSION DATE A 03/26/09 PAGE DESCRIPTION New Create Preliminary Preliminary Designation The "Preliminary" designation on a Winbond datasheet indicates that the product is not fully characterized. The specifications are subject to change and are not guaranteed. Winbond or an authorized sales representative should be consulted for current information before using this product. Trademarks Winbond and SpiFlash are trademarks of Winbond Electronics Corporati
r ordering. However, due to limited space, the Top Side Marking on all packages use an abbreviated 10-digit number. PACKAGE TYPE SN SOIC-8 150mil SS SOIC-8 208mil ZP(1) WSON-8 6x5mm DENSITY 4M-bit 4M-bit 4M-bit PRODUCT NUMBER TOP SIDE MARKING W25Q40BVSNIG W25Q40BVSNIP W25Q40BVSSIG W25Q40BVSSIP W25Q40BVZPIG W25Q40BVZPIP 25Q40BVNIG 25Q40BVNIP 25Q40BVSIG 25Q40BVSIP 25Q40BVIG 25Q40BVIP Note: 1. WSON package type ZP is not used in the top side marking. - 72 - W25Q40BV 12. REVISION HISTORY VERSION DATE A 03/26/09 B 07/08/10 PAGE DESCRIPTION New Create Preliminary 15 49, 52 & 53 67-69 62 & 65 5, 8, 19, 54-56 Updated memory protection description Updated 90h, 4Bh & 9Fh waveforms Updated package diagrams Updated parameter VIL/VIH, tSE, tPP Added SFDP feature Preliminary Designation The "Preliminary" designation on a Winbond datasheet indicates that the product is not fully characterized. The specifications are subject to change and are not guaranteed. Winbond or an authorized sales representative should b
ges use an abbreviated 10-digit number. PACKAGE TYPE DENSITY SN SOIC-8 150mil SV VSOP-8 150mil SS SOIC-8 208mil 4M-bit (1) 4M-bit 4M-bit ZP WSON-8 6x5mm 4M-bit DA PDIP-8 300mil 4M-bit (2) UX USON-8 2x3mm 4M-bit PRODUCT NUMBER TOP SIDE MARKING W25Q40BVSNIG W25Q40BVSNIP W25Q40BVSVIG W25Q40BVSVIP W25Q40BVSSIG W25Q40BVSSIP W25Q40BVZPIG W25Q40BVZPIP W25Q40BVDAIG W25Q40BVDAIP W25Q40BVUXIG W25Q40BVUXIP 25Q40BVNIG 25Q40BVNIP 25Q40BVVIG 25Q40BVVIP 25Q40BVSIG 25Q40BVSIP 25Q40BVIG 25Q40BVIP 25Q40BVAIG 25Q40BVAIP 4Dxxx 0Gxxxx 4Dxxx 0Pxxxx Note: 1. WSON package type ZP is not used in the top side marking. 2. USON package type UX has special top marking due to size limitation. 4 = 4Mb; D = W25Q series, 3V; 0 = Standard Part; G = Green; P = OTP enabled. - 72 - W25Q40BV 11. REVISION HISTORY VERSION DATE A 03/26/09 PAGE DESCRIPTION New Create Preliminary B 07/08/10 15 49, 52 & 53 67-69 62 & 65 5, 8, 19, 54-56 C 05/04/12 All 6, 65-72 54 Updated memory protection description Updated 90h, 4Bh & 9Fh waveforms Updated