Product Datasheet Search Results:

DS34T108GN+.pdf74 Pages, 805 KB, Original
DS34T108GN+
Maxim Integrated Products, Inc.
Single/Dual/Quad/Octal TDM-Over-Packet Chip
DS34T108GN+.pdf366 Pages, 3712 KB, Original
DS34T108GN+
Maxim Integrated
IC TDM OVER PACKET 484HSBGA

Product Details Search Results:

Maximintegrated.com/DS34T108GN+
{"Category":"Integrated Circuits (ICs)","Product Photos":"484-BGA Exp Pad","Family":"Specialized ICs","Series":"-","Package / Case":"484-BGA Exposed Pad","Supplier Device Package":"484-HSBGA (23x23)","Product Training Modules":"Lead (SnPb) Finish for COTS Long-Term Supply Program","Packaging":"Tray","Applications":"Data Transport","Datasheets":"DS34T101,102,104,108","Standard Package":"30","Mounting Type":"Surface Mount","Type":"TDM (Time Division Multiplexing)"}...
1452 Bytes - 15:58:18, 05 January 2026

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