Product Datasheet Search Results:

IDT1339-31DVGI8.pdf26 Pages, 305 KB, Original
IDT1339-31DVGI8
Integrated Device Technology
IC SERIAL RTC I2C LP 8-MSOP - IDT1339-31DVGI8

Product Details Search Results:

Idt.com/1339-31DVGI8
{"Category":"Integrated Circuits (ICs)","Current - Timekeeping (Max)":"200\u00b5A @ 3.63V ~ 5.5V","Operating Temperature":"-40\u00b0C ~ 85\u00b0C","Memory Size":"-","Package / Case":"8-TSSOP, 8-MSOP (0.118\", 3.00mm Width)","Type":"Clock/Calendar","Product Photos":"8-TSSOP 8-MSOP","PCN Assembly/Origin":"Wafer Fab Transfer 08/Apr/2014 Wafer Fab Transfer Revision 02/Jul/2014","PCN Design/Specification":"Gpld/Copper Bond Wire 21/Dec/2012","Date Format":"YY-MM-DD-dd","Datasheets":"IDT1339 IDT133(7-9) Brief","Ti...
1997 Bytes - 07:39:43, 01 November 2024

Documentation and Support

Use our online request for specific proposed solutions or send your technical question directly to a product specialist at request:

File NameFile Size (MB)DocumentMOQSupport
BULLET_LIQUIDTIGHT_FITTINGS_LIQUIDTIGHT_FLEXIBLE_NON_METALLIC_CONDUIT.pdf0.501Request
US2:IDT5000.pdf2.381Request
ABB_T_B_LIQUIDTIGHT_CATALOGUE_IT.pdf7.721Request
TDS000137_T_B_LIQUIDTIGHT_BULLET_QUICK_CONNECT.pdf0.711Request
ABB_T_B_LIQUIDTIGHT_SYSTEMS_CATALOGUE_CANADA.pdf7.381Request
T_B_LIQUIDTIGHT_FITTINGS_APPLICATION_PROFILE_SS_SOLUTIONS.pdf0.601Request
TDS000118_T_B_LIQUIDTIGHT_SERIES_5200AL_ALUMINUM.pdf0.541Request
LIQUIDTIGHT_APPLICATION_PROFILE_GENERAL_PURPOSE.pdf0.621Request
T_B_LIQUIDTIGHT_F_B_SEAL_KIT_POSTCARD_SAMPLE_KIT.pdf0.771Request
LIQUIDTIGHT_FLEXIBLE_NON_METALLIC_CONDUIT_TYPE_B_AND_FITTINGS_ENGLISH.pdf0.741Request
LIQUIDTIGHT_APPLICATION_PROFILE_ALUMINUM.pdf0.631Request
BULLET_QUICK_CONNECT_LIQUIDTIGHT_FITTINGS_TDS000137.pdf0.711Request